INFLUENCE OF A FLUX OF HIGH‐VELOCITY MICROPARTICLES ON THE PARAMETERS OF INTEGRATED CIRCUITS PLACED BEHIND A THICK‐WALLED OBSTACLE

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Abstract

Experimental data showing that on collision of a flux of high‐velocity microparticles (which is close to the fluxes of space particles in parameters) with a thick‐walled metal obstacle we have failure of integrated circuits placed behind this obstacle have been given.

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