Nickel and copper deposition on fine alumina particles by using the chemical vapor deposition-circulation fluidized bed reactor technique


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Abstract

A Chemical Vapor Deposition-Circulation Fluidized Bed Reactor technique has been developed to deposit metallic Ni and Cu onto alumina particles of 45 μm diameter. The furnaces consisted of upper and lower zones, and the deposition precursors were produced both in situ and by vaporization of chlorides. X-ray diffraction, metallographical examination, and compositional analysis were used to analyze the deposition layers. For both Ni and Cu deposition, the deposition rates increased with higher temperatures of the lower furnace. The rates increased with greater amounts of chloride addition as well, but they reached plateaus when the amounts of addition were more than 40%.

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